來源:加強型焊柱CU-CCGA 發(fā)布時間:2017.05.02
新產(chǎn)品簡介-加強型焊柱Cu-CCGA
加強型錫柱是在普通錫柱的基礎(chǔ)上演變而來。通過在普通焊線上繞一定規(guī)格的銅線,然后在進行電鍍Sn63/Pb37合金形成良好的外觀。加強型焊柱具有比普通焊錫柱更好的熱循環(huán)性能,同時在CCGA封裝時,Sn20/Pb80(固相點183℃,液相點280℃)合金具有更好的回流焊窗口。
Copper wrap solder columns based on the plain solder columns are an advnced development.we will wind a certain size copper wires or copper foils around the core solder wire, then The hot solder coating(Sn63/Pb37 eutectic alloy) is appendedCompared with traditional plain solder columns,copper wrap solder columns have better thermal cycling ability, and Sn20/Pb80 alloy (The solidus temperature, 183℃, the liquidus temperature, 280℃) makes it more suitable for reflow soldering window.
剖面圖 Cross-section
對 比 Comparison
亮 點 Lightspot
規(guī)格與型號 Specifications